English Books > Technical > CD format - General > 2nd Electronic Packaging Technology Conference

2nd Electronic Packaging Technology Conference
CD-ROM
Published: February 2001
IEEE Press
ISBN: 078036645X
This item non-returnable. Order may not be canceled.

Topics covered by this title include: packaging materials; packaging trends; thermal design and modelling; solder joint metallurgy; process and reliability modelling; thermal characterization; materials characterization techniques; and assembly/manufacturing technologies.



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